PRODUCT
PRODUCT
Contacts：
Xinxiu Zhu
Tel：
15223848168
Email：
sd02@qunwin.com
QQ：
876843941
Address：
Lidu Park，F(xiàn)uling District，Chongqing，China
PRODUCT
This product solves the problem of thermal expansion coefficient mismatch in the application of large-size ceramic chips, improves the reliability of solder points, and is widely used in aerospace, military and large servers. The main advantages of this product are dimensional accuracy control and end roundness, long service life, flatness and welding ability.
15223848168
.jpg?2024120607393722)
