The factory

The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.

The factory

The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.

The factory

The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.

The factory

The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.

The factory

The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.

The factory

The company has set up a new product research and development center, and has maintained a good cooperative relationship with many domestic universities, has been successful in the development of ordinary tin cylinder, copper core ball, micro-spring ring, enhanced tin cylinder and other high-end packaging electronic solder filler metal, to fill in the domestic technical gaps.