PRODUCT
PRODUCT
Contacts:
Xinxiu Zhu
Tel:
15223848168
Email:
sd02@qunwin.com
QQ:
876843941
Address:
Lidu Park,F(xiàn)uling District,Chongqing,China
PRODUCT
Solder ball is key part of a semiconductor packaging technology like BGA and CSP. Solder ball is technology-intensive product that transmit electric signals by connecting chips and boards.we can supply as small as 50um solder ball, and support custom specifications.